Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
$101.00
Description
Book Synopsis: Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example.
Features:
- Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars.
- Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded.
- Examines innovative low-cost thermal and power systems.
- Explains how to design to survive rocket launch, the surfaces of Mars and Venus.
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.
Details
Are you fascinated by the incredible engineering behind spacecraft designed for space exploration? Have you ever wondered how NASA is able to build hardware that can withstand extreme temperatures and harsh environments? Look no further than the book "Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments."
Authored by experienced NASA/JPL engineers, this book will take you behind the scenes of some of the most groundbreaking space missions, including the Mars Exploration Rovers and the Dawn ion propulsion spacecraft. With practical insights and practical approaches, you'll learn how to solve complex thermal-structural problems and design spacecraft that can survive the harshest conditions.
Featuring case studies from NASA's Jet Propulsion Laboratory, this book provides valuable knowledge and techniques for spacecraft designer engineers. You'll be able to create structurally and thermally sound designs, reduce design and test cycles, and ensure reliability in the quickest time possible.
From surviving rocket launches to enduring the surfaces of Mars and Venus, this book covers it all. Whether you're a practicing professional or an upper-level student in aerospace, mechanical, thermal, electrical, or systems engineering, "Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments" is a must-read.
With cutting-edge information and innovative approaches, this book will equip you with the tools and knowledge to tackle the challenges of designing satellites for extreme outer space environments. Don't miss out on this opportunity to learn from the experts at NASA. Take your engineering skills to new heights and dive into the world of space exploration.
Ready to embark on an interstellar journey? Get your copy of "Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments" now: Buy Now
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